Intel Accelerates Process and Packaging Innovations
7/27/2021During the "Intel Accelerated" webcast, Intel's technology leaders revealed one of the most detailed process and packaging technology roadmaps the company has provided. The event on July 26, 2021, showcased a series of foundational innovations that will power products through 2025 and beyond. As part of the presentations, Intel announced RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method. (Credit: Intel Corporation)