Intel Foveros Technology Explained

Intel's Foveros technology leverages wafer-level packaging capabilities to provide a first-of-its-kind 3D stacking solution. Foveros enables Intel to build processors with compute tiles stacked vertically, rather than side-by-side, providing greater performance in a smaller footprint. It also allows Intel to mix and match compute tiles to optimize for cost and power efficiency. (Credit: Intel Corporation)