Foveros Direct: Advanced Packaging Technology to Continue Moore’s Law

Foveros Direct is Intel’s next-gen advanced packaging that allows for more flexible and tighter integration between tiles. Instead of using solder connections, which slow down data transfer, Foveros Direct implements direct copper-to-copper connections that result in lower latency and higher bandwidth while reducing die area required for communication. This video highlights the innovation that was used to achieve an order of magnitude increase in interconnect density.