TSMC CoWoS Supply Reserved By NVIDIA & AMD Until 2025

TSMC’s CoWoS Technology

TSMC (Taiwan Semiconductor Manufacturing Company) is a global leader in semiconductor fabrication. Their advanced packaging technologies play a crucial role in enabling high-performance computing devices. One such technology is CoWoS (Chip-on-Wafer-on-Substrate), which allows multiple chips to be stacked and interconnected on a single package.

The AI Race and Insatiable Demand

The AI industry is hungry for computational power, especially as applications like machine learning, deep learning, and data analytics become increasingly prevalent. Both NVIDIA and AMD are at the forefront of this race, developing powerful GPUs and accelerators to meet the demands of AI workloads.

TSMC’s Packaging Gold Rush

TSMC finds itself in the midst of a packaging gold rush. Not only is there immense demand for their existing facilities, but they’ve also massively upscaled their packaging processes. CoWoS, along with the newer SoIC (System on Integrated Chip) standard, has become pivotal.

NVIDIA’s Hopper and Blackwell GPUs

NVIDIA leverages CoWoS technology for its upcoming Hopper GPUs and the latest Blackwell GPUs. These chips require advanced packaging solutions to achieve optimal performance.

AMD’s MI300 Accelerators

On the other side, AMD utilizes CoWoS for its MI300 accelerators. These accelerators are designed for AI and high-performance computing tasks, and their packaging plays a critical role in ensuring efficient data flow.

TSMC’s Scaling Efforts

To meet the soaring demand, TSMC plans to significantly scale its production facilities. By the end of this year, they aim to achieve an output of 45,000 to 55,000 units – a substantial year-on-year increase.

The Rise of SoIC

But that’s not all. TSMC is also eyeing the next generation of packaging: SoIC. System on Integrated Chip (SoIC) offers superior density stacking capabilities and ultra-high bandwidth. While NVIDIA is yet to integrate SoIC into its AI architectures, AMD has already done so with its primary Instinct MI300 AI accelerators.

SoIC’s Future

Anticipating future demand, TSMC plans to produce 10,000 SoIC units by 2025. This transition to SoIC will open up new opportunities for chip packaging standards, setting the stage for even more innovation.

In summary, TSMC’s CoWoS supply is now exclusively reserved by NVIDIA and AMD, reflecting the fierce competition in the AI industry. As technology continues to evolve, SoIC promises to be the next frontier in chip packaging.