Intel’s 3nm Lunar Lake & Arrow Lake CPUs Enter Mass Production at TSMC

Intel’s next-generation Core Ultra 200 processors have officially entered mass production at TSMC’s 3nm fabs. This development marks a significant milestone for Team Blue, as it’s the first time they’ve collaborated with TSMC for CPU fabrication.

Lunar Lake Details

• Process Node: Lunar Lake CPU dies will be fabbed on TSMC’s N3B node.
• Architecture: Lunar Lake features a hybrid design with 4x P-cores and 4x E-cores.
• Graphics: It introduces the Xe2 “Battlemage” graphics architecture with improved SIMD, caches, and display capabilities.
• Hyper-Threading: Unlike previous Intel processors, Lunar Lake lacks hyper-threading.
• Power Efficiency: The Core Ultra 200V processors are designed for power efficiency, outperforming AMD’s Zen 4-based Phoenix and Snapdragon 8cx Gen 3 chips.

Arrow Lake Insights

• Desktop CPUs: Arrow Lake-S processors for desktops will be Intel’s first multi-chiplet design with advanced packaging.
• Hyper-Threading: Arrow Lake-S CPUs won’t support hyper-threading, raising questions about their multi-threaded performance.
• Release Timeline: Unlocked Arrow Lake-S processors and the Z890 chipset are expected in October, followed by non-K variants at CES 2025.

In summary, Intel’s collaboration with TSMC for Lunar Lake and Arrow Lake CPUs promises exciting advancements in performance and efficiency. Stay tuned for further updates as we approach the official launch dates! 🚀