Intel LGA1851 Socket Introduces RL-ILM for Improved Thermal Performance

Intel’s upcoming LGA1851 socket promises exciting changes for enthusiasts and overclockers. Let’s dive into the details:

The Problem with LGA1700

The LGA1700 socket, used in 12th Generation Alder Lake, 13th Generation Raptor Lake, and 14th Generation Raptor Lake Refresh CPUs, has been notorious for its unfriendly design. The culprit? The Independent Loading Mechanism (ILM), which caused CPUs to bend when installed. Poor contact with CPU coolers led to varying temperature increases, frustrating overclockers.

Enter RL-ILM

Intel’s solution: the Reduced Load ILM (RL-ILM). This optional upgrade aims to enhance thermal performance without requiring custom contact frames. Key points:

1. Two ILM Types:

   • Default ILM: Similar to LGA1700’s, angled at 2 degrees.
   • RL-ILM: Flat design with improved thermal performance. Covered under Intel warranty and optional for system vendors at <$1 per unit.

2. Cooling Compatibility:

   • RL-ILM addresses the CPU bending issue, ensuring better contact with coolers.
   • Vendors targeting high-end overclockers may adopt RL-ILM.

3. Design Alterations:

   • RL-ILM spreads contact points across the Integrated Heat Spreader (IHS), reducing CPU bending risk.
   • Expect uniform cooling performance and efficiency gains.

The Future of LGA1851

If legitimate, RL-ILM could revolutionize the LGA1851 socket. No more aftermarket contact frames—overclockers rejoice! Stay tuned for official design details from Intel.