Intel Lunar Lake “Core Ultra 200V” CPUs Launching on September 3rd: A New Era for Thin & Light Laptops

Intel Lunar Lake “Core Ultra 200V” CPUs Launching on September 3rd: A New Era for Thin & Light Laptops

Intel has officially announced the launch of its next-generation Lunar Lake “Core Ultra 200V” CPUs, set for September 3rd. These CPUs represent a significant leap forward for Intel, combining innovative architectures and software advancements to target thin and light platforms such as laptops, notebooks, handhelds, and Mini PCs.

Key Features of Intel Lunar Lake “Core Ultra 200V” CPUs

The Lunar Lake CPUs will feature four major components:

  1. CPU Architecture: The new Lion Cove P-Cores and Skymont E-Cores promise substantial gains in Instructions Per Cycle (IPC).
  2. GPU Architecture: The integrated GPU will utilize the new “Xe2” architecture, introducing XMX capabilities.
  3. NPU4: This component will deliver up to 48 TOPS, providing a total of 120 TOPS of AI computing power in a compact System on Chip (SOC).

Launch Event Details

Intel will unveil the Lunar Lake “Core Ultra 200V” CPUs during an exclusive event in Berlin, Germany, just before the IFA 2024 conference. The event will feature Intel executives Michelle Johnston Holthaus and Jim Johnson, along with Intel partners, who will discuss the new processors’ x86 power efficiency, core performance, graphics performance, and AI computing power.

  • Date: September 3rd
  • Time: 6 PM CEST (9 AM PDT)
  • Location: Berlin

What to Expect from Lunar Lake “Core Ultra 200V” CPUs

The next-gen platform will offer up to 4 P-Cores, 4 E-Cores, and up to 8 Xe2 GPU cores, along with 48 TOPS of AI performance. These chips will be available in tightly packaged SOC designs with integrated memory, offering 16 GB and 32 GB LPDDR5x-8533 options. The CPUs will come in 17W and 30W configurations.

Detailed CPU Lineup

Table
SKU Name Cores / Threads Cache (LLC) P-Core / E-Core Boost GPU (Max Clock) PL1 & PL2 (PBP/MTP) Memory Configuration NPU / XMX (GPU) TOPs
Core Ultra 9 288V 8/8 12 MB 5.1 / 3.7 GHz Arc 140V @ 2.05 GHz 30W/30W 32 GB (2R) LPDDR5X 48/67
Core Ultra 7 268V 8/8 12 MB 5.0 / 3.7 GHz Arc 140V @ 2.00 GHz 17W/30W 32 GB (2R) LPDDR5X 48/66
Core Ultra 7 266V 8/8 12 MB 5.0 / 3.7 GHz Arc 140V @ 2.00 GHz 17W/30W 16 GB (1R) LPDDR5X 48/66
Core Ultra 7 258V 8/8 12 MB 4.8 / 3.7 GHz Arc 140V @ 1.95 GHz 17W/30W 32 GB (2R) LPDDR5X 47/64
Core Ultra 7 256V 8/8 12 MB 4.8 / 3.7 GHz Arc 140V @ 1.95 GHz 17W/30W 16 GB (1R) LPDDR5X 47/64
Core Ultra 5 238V 8/8 8 MB 4.7 / 3.5 GHz Arc 130V @ 1.85 GHz 17W/30W 32 GB (2R) LPDDR5X 40/53
Core Ultra 5 236V 8/8 8 MB 4.7 / 3.5 GHz Arc 130V @ 1.85 GHz 17W/30W 16 GB (1R) LPDDR5X 40/53
Core Ultra 5 228V 8/8 8 MB 4.5 / 3.5 GHz Arc 130V @ 1.85 GHz 17W/30W 32 GB (2R) LPDDR5X 40/53
Core Ultra 5 226V 8/8 8 MB 4.5 / 3.5 GHz Arc 130V @ 1.85 GHz 17W/30W 16 GB (1R) LPDDR5X 40/53

Software Innovations

Intel will introduce new optimizations for Lunar Lake through enhancements in Thread Director, Power Management, and Security systems. The Core Ultra 200V CPUs will also be the first to fully comply with Copilot+ requirements, marking Intel’s entry into the “AI PC” segment, competing with Qualcomm Snapdragon X and AMD’s Ryzen AI 300.