AMD Strix Halo APU Leak: Twice the Size, Powerful RDNA 3.5 iGPU, Up to 120W TDP

Introduction

AMD’s Strix Halo APUs for enthusiast mobile platforms have been further detailed in a new leak, revealing some fascinating aspects of the chip. These APUs are set to power the ASUS ROG Flow Z13 (2025) PC tablet, a semi-tablet and semi-laptop design that promises exceptional performance.

Key Features of AMD Strix Halo APU

The AMD Strix Halo APU is composed of three chiplets: two Zen 5 CCDs and a singular GPU die featuring the I/O and memory controllers. The Zen 5 CCDs measure 66.345 mm² and 70.6 mm², including the die stiffeners. Each CCD houses 8 cores, totaling up to 16 cores and 32 threads based on the Zen 5 architecture. An 8-core Strix Halo configuration with up to 5.36 GHz clocks has also been covered recently.

Impressive iGPU Specifications

The iGPU die measures 19.18 x 16.02mm or 307 mm², larger than the entire Strix Point APU, which measures 232.5 mm². This iGPU packs up to 40 RDNA 3.5 compute units, offering substantial performance. The complete Strix Halo die dimensions are 24.04mm x 19.78mm, equating to 475.31 mm², nearly twice the size of the Strix Point APU.

Power and Thermal Management

The power breakdown of the AMD Strix Halo APU is detailed as follows:

Zen 5 CCDs (CCD0 & CCD1): 15W each, totaling 30W.
IOD (RDNA 3.5 iGPU + IO controllers): 72W.
SO-DIMM memory: 13W.

In total, the chip consumes around 115W, excluding the memory, which will be in standard SO-DIMM configurations, available in 32 GB and up to 128 GB flavors.

Configurations and Memory Support

The FP11 socket is confirmed through official AMD documentation, with three configurations of the AMD Strix Halo APUs ranging from 55W, 85W, and up to 120W. These configurations support 32 GB (+5-9W) and up to 128 GB (+10-13W) memory. The memory types supported by Strix Halo include both SO-DIMM and LPDDR5X, with speeds up to 8533 MT/s and 256-bit channels.

Comparison with High-End GPUs

The AMD RDNA 3.5 iGPU, with up to 40 compute units, is compared to Intel Raptor Lake and NVIDIA GeForce RTX 4070 (GN21) chips, which also come in 115W solutions. This comparison highlights AMD’s push to achieve high performance with an integrated graphics solution in a chiplet design.

Expected Features and Launch

The AMD Ryzen AI HX Strix Halo is expected to feature:

Zen 5 Chiplet Design
Up to 16 Cores
64 MB of Shared L3 cache
40 RDNA 3+ Compute Units
32 MB MALL Cache (for iGPU)
256-bit LPDDR5X-8000 Memory Controller
XDNA 2 Engine Integrated
Up to 60 AI TOPS
16 PCIe Gen4 Lanes
2H 2024 Launch (Expected)
FP11 Platform (55W-130W)

Thermal Enhancements in ASUS ROG Flow Z13

The 2025 design of the ASUS ROG Flow Z13 will feature several thermal enhancements, including a Vapor Chamber with 1.3mm thickness, two cooling fans with up to 2000 RPM, proper ventilation, and the ability to run AMD’s Strix Halo APUs at their full 120W configurations in a 13-inch design.

Conclusion

AMD’s Strix Halo APUs are set to launch in 2025, alongside other Zen 5 mobile products such as Fire Range and Krackan Point. These products will be incorporated into various laptops, tablets, handhelds, and Mini PCs throughout the coming year, promising innovative designs and exceptional performance.