Intel 18A Status Update: First Chips Booting, First External Customer Tape-Out in First Half 2025

Intel 18A Status Update: First Chips Booting, First External Customer Tape-Out in First Half 2025

Intel has made significant strides in its semiconductor technology with the latest updates on its 18A process node. This article delves into the recent developments, highlighting the successful booting of the first 18A chips and the anticipated tape-out for the first external customer in the first half of 2025 (H1’25).

Intel 18A: A Leap in Semiconductor Technology

Intel’s 18A process node represents a critical advancement in semiconductor manufacturing. As part of Intel’s ambitious “5 Nodes in 4 Years” roadmap, the 18A node is set to refine the company’s RibbonFET and PowerVia technologies. These innovations are crucial for Intel to regain its leadership in the semiconductor industry.

First 18A Chips Booting Successfully

The most exciting news from Intel is that the first 18A chips have returned from the development fab and are successfully booting operating systems. This milestone indicates that the silicon not only powers on but also performs core tasks efficiently. The chips, including Panther Lake for clients and Clearwater Forest for servers, are now operational, marking a significant step forward for Intel.

External Customer Tape-Out in H1’25

Intel is also preparing for its first external customer chip design to tape out in the first half of 2025. This development is a testament to Intel’s commitment to its foundry services and its ability to deliver cutting-edge technology to external partners. The successful tape-out will be a crucial milestone, showcasing Intel’s capability to meet the demands of its customers with advanced semiconductor solutions.

Technological Innovations: RibbonFET and PowerVia

The 18A process node incorporates several groundbreaking technologies. RibbonFET, Intel’s implementation of gate-all-around (GAA) transistors, and PowerVia, a backside power delivery network, are pivotal in enhancing performance and efficiency. These technologies are expected to provide Intel with a competitive edge in the semiconductor market.

Future Prospects and Industry Impact

Intel’s progress with the 18A node is a promising sign for the company’s future. The successful booting of the first chips and the upcoming external customer tape-out highlight Intel’s dedication to innovation and excellence. As Intel continues to refine its semiconductor technologies, the industry can expect significant advancements that will drive the next generation of computing.

In conclusion, Intel’s 18A process node is poised to revolutionize the semiconductor industry. With the first chips successfully booting and the first external customer tape-out scheduled for H1’25, Intel is on track to reclaim its position as a leader in semiconductor technology.