TSMC to Receive ASML's High-NA EUV Equipment by End of Year, Costing $350 Million
11/01/2024TSMC to Receive ASML's High-NA EUV Equipment by End of Year, Costing $350 Million
Introduction
Taiwan Semiconductor Manufacturing Company (TSMC) is set to receive the first batch of ASML's high-NA EUV lithography equipment by the end of 2024, with each unit costing around $350 million.
Key Details
Equipment: The high-NA EUV equipment, known as the Twinscan EXE:5000, features an 8nm resolution and a 13.5nm EUV light wavelength.
Performance: This equipment enables chipmakers to produce chips that are 1.7 times smaller and achieve 2.9 times higher transistor densities.
Cost: Each unit costs approximately $350 million, making it a significant investment for TSMC.
Implementation: TSMC plans to use the high-NA EUV equipment for its 1.4nm (A14) process, scheduled for mass production in 2027.
Market Impact: High-NA EUV technology is considered the "holy grail" of the semiconductor industry, with major players like Intel and Samsung also investing in this advanced technology.
Implications for Users
The introduction of high-NA EUV equipment is expected to significantly enhance the performance and efficiency of semiconductor manufacturing, leading to more powerful and compact chips for various applications.
Conclusion
With the acquisition of ASML's high-NA EUV equipment, TSMC is poised to maintain its competitive edge in the semiconductor industry, paving the way for next-generation chip manufacturing.
Frequently Asked Questions (FAQs)
Q: What is the Twinscan EXE:5000? A: It is ASML's high-NA EUV lithography equipment with an 8nm resolution and a 13.5nm EUV light wavelength.
Q: How much does each unit cost? A: Each unit costs approximately $350 million.
Q: When will TSMC start using the high-NA EUV equipment in production? A: TSMC plans to use the equipment for its 1.4nm (A14) process, scheduled for mass production in 2027.