TSMC 2nm Process Unveiled at IEDM 2025: How It Stacks Up Against Competitors

At the International Electron Device Meeting (IEDM) 2025, TSMC revealed critical details about its 2nm process technology, showcasing advancements in nanosheet transistors and backside power delivery. This article summarizes TSMC's 2nm process, its performance metrics, and how it compares to competitors like Intel and Samsung. With the semiconductor industry pushing toward smaller nodes, TSMC's 2nm node is poised to drive innovation in AI, mobile, and high-performance computing (HPC).

TSMC 2nm Process: Key Features

TSMC's 2nm process, branded as N2, introduces nanosheet gate-all-around (GAA) transistors, a significant leap from the FinFET architecture used in its 3nm node. Key features include:

Nanosheet Transistors: TSMC's 2nm node uses nanosheets with a 22nm gate length and 45nm channel width, enabling improved performance and power efficiency.
Backside Power Delivery Network (BSPDN): TSMC integrates backside power delivery, reducing IR drop and improving power efficiency. This is achieved through a 200nm thick copper layer and a 40nm via pitch.
Transistor Density: The 2nm process achieves a transistor density of 340 million transistors per square millimeter (MTx/mm²), a 1.4x increase over the 3nm node.
Performance Gains: TSMC claims a 10-15% performance improvement at iso-power or a 25-30% power reduction at iso-performance compared to 3nm.

These advancements position TSMC's 2nm node as a leader in density, efficiency, and performance for next-generation applications.

TSMC 2nm vs. Competitors: Intel and Samsung

The 2nm node race is heating up, with Intel and Samsung also advancing their technologies. Here's how TSMC's N2 measures up:

Intel 20A and 18A: Intel's 20A (2nm equivalent) and 18A nodes also adopt GAA transistors and backside power delivery. Intel claims a 15% performance boost for 20A over its 3nm-class Intel 4 process. However, TSMC's N2 offers superior transistor density (340 MTx/mm² vs. Intel's estimated 300 MTx/mm²).
Samsung 2nm (SF2): Samsung's 2nm process, SF2, similarly uses GAA transistors but lags in density, with an estimated 280 MTx/mm². TSMC's N2 also benefits from a more mature backside power delivery implementation, giving it an edge in power efficiency.

TSMC's lead in density and efficiency makes it a preferred choice for foundry customers like Apple, NVIDIA, and AMD, who demand cutting-edge performance for AI and HPC workloads.

Challenges and Innovations

Despite its advancements, TSMC's 2nm process faces challenges:

EUV Lithography: The 2nm node relies heavily on extreme ultraviolet (EUV) lithography, requiring precise control to mitigate defects. TSMC has optimized its EUV processes, but scaling remains complex.
Backside Power Delivery: While BSPDN improves efficiency, it introduces manufacturing complexity. TSMC's use of a 200nm copper layer and 40nm via pitch demonstrates its ability to overcome these hurdles.

TSMC's innovations, such as nanosheet stacking and advanced packaging, ensure that the 2nm node meets the demands of high-performance devices while maintaining yield and reliability.

Market Implications and Adoption

TSMC's 2nm process is expected to enter risk production in mid-2025, with mass production slated for 2026. Early adopters, including Apple for its A-series chips and NVIDIA for GPUs, are likely to leverage N2 for flagship products. The node's efficiency gains will also benefit mobile devices, reducing power consumption and extending battery life.

The 2nm node strengthens TSMC's position in the foundry market, where it holds a 61% share (Q3 2024). However, Intel's aggressive push with 20A/18A and Samsung's SF2 could intensify competition, especially in AI and automotive sectors.

Conclusion

TSMC's 2nm process, unveiled at IEDM 2025, sets a new benchmark in semiconductor technology with its nanosheet transistors, backside power delivery, and industry-leading density. While Intel and Samsung are closing the gap, TSMC's N2 offers superior performance and efficiency, making it a top choice for AI, mobile, and HPC applications. As the 2nm node enters production, TSMC is well-positioned to maintain its foundry leadership, driving innovation in the semiconductor industry.