AMD Ryzen Dual X3D and Intel Nova Lake Dual bLLC: Major CPU Leaks Surface Side by Side

AMD Ryzen Dual X3D and Intel Nova Lake Dual bLLC: Major CPU Leaks Surface Side by Side

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In early August 2025, both AMD and Intel made headlines after major leaks revealed details about their next-generation CPU architectures. AMD’s Ryzen “Dual X3D” and Intel’s Nova Lake with “Dual bLLC” emerged almost simultaneously, pointing to a fiercely competitive future for PC enthusiasts and gamers. Here’s what’s been uncovered.

AMD Ryzen Dual X3D: Doubling Down on 3D V-Cache

The latest leaks indicate AMD is preparing two new Ryzen 9000X3D CPUs built on the Zen 5 architecture and featuring the company's signature 3D V-Cache technology. Most notably, the top model is rumored to carry 3D V-Cache stacked on both CPU chiplets (CCDs), delivering a staggering 192MB of L3 cache and a 200W TDP—the largest cache ever on a desktop consumer processor.

  • 16-core, 32-thread Ryzen 9000X3D with 192MB L3 cache, 200W TDP (dual chiplet, both with V-Cache)
  • 8-core, 16-thread Ryzen 9000X3D with 96MB L3 cache, 120W TDP (single chiplet, with V-Cache)

Previously, AMD only used 3D V-Cache on one chiplet in dual-CCD chips (such as the 7950X3D). This is the first time both chiplets will receive the extra stacked cache. For gamers, especially those who play open-world or simulation games that benefit from large caches, this could mean notable performance gains. However, actual benefits and pricing are yet to be confirmed.

Intel Nova Lake Dual bLLC: Chasing Cache Supremacy

Intel’s upcoming Nova Lake platform is rumored to introduce “dual bLLC” — big Last-Level Cache — configurations. Some leaks suggest versions with as much as 144MB or more of advanced cache (potentially L4 or large system-level cache) in addition to substantial core count increases (up to 52 cores in certain models, with “Coyote Cove” P-cores and “Arctic Wolf” E-cores) and the use of TSMC’s N2 process for compute tiles.

Nova Lake’s bLLC variants appear to target mid-range models first (such as 8P+16E or 8P+12E Core Ultra 5 parts). The big Last-Level Cache should reduce gaming and productivity bottlenecks by improving cache bandwidth and lowering latency, marking Intel’s most direct answer yet to AMD’s popular 3D V-Cache CPUs.

What Does This Mean for PC Enthusiasts?

  • Cache is key for gaming in 2025. Both AMD’s move to dual X3D chiplets and Intel’s bLLC feature reveal cache as a primary tool in delivering faster, smoother games and workloads.
  • Expect higher power and prices. With flagship CPUs pushing 200W and massive cache, these new chips will demand powerful cooling and won’t be budget models.
  • Motherboards are evolving too. Next-gen boards will likely offer more PCIe 5.0 lanes and improved memory support to work alongside the new CPU designs.
  • Exact launch dates unconfirmed. AMD’s dual X3D CPUs are expected late 2025 or early 2026. Intel’s Nova Lake desktop chips may arrive in mid or late 2026, following their mobile lineup.

Summary Table: Leaked Specs (as of August 2025)

CPU Cores / Threads Cache TDP Cache Feature Status
AMD Ryzen 9000X3D (flagship) 16C / 32T 192MB L3 200W Dual 3D V-Cache (both CCDs) Rumored
AMD Ryzen 9000X3D (mid) 8C / 16T 96MB L3 120W 3D V-Cache (single CCD) Rumored
Intel Nova Lake (top) Up to 52 (P+E+LPE) Up to 144MB+ bLLC 125–150W Big Last-Level Cache Rumored
Intel Nova Lake (Core Ultra 5 SKUs) 8P+16E / 8P+12E bLLC (exact size TBD) ~125W Big Last-Level Cache Rumored

Specifications above are based on leaks and may change upon official announcements.

Conclusion

AMD and Intel are both pushing desktop CPU innovation with massive cache and advanced architectures. Enthusiasts and gamers can look forward to higher frame rates and performance—but should also prepare for increased power demands and likely higher costs. As these processors move from rumor to retail in late 2025 and through 2026, expect major shifts in what’s possible for desktop PC performance.